- Category:
- Other systems
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- File Size:
- 1kb
- Update:
- 2019-05-11
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- dyj
Description: ANSYS simulation of temperature field and automatic filling of solder in plate filling welding based on life and death element method.
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| Filename | Size | Date |
|---|
| 基于生死单元法的平板填充焊接温度场分析.txt | 1714 | 2019-01-31 |
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