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Description: 瑞星微公司RK27XX系列芯片的SDK开发包，源码齐备，ADS1.20编译，在RK2706开发板上面验证过，跑起来就是一个功能完备的PMP。-Rising Micro-chip companies RK27XX Series SDK development kit, source code available, ADS1.20 compiler, in the development board RK2706 verified above, running is a full-featured PMP.
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Size: 29104128 |
Author: 龚俊 |
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Description: Samsung公司S3C6400芯片的BSP源码包，支持WinCE6.0，在samsung开发板上面验证通过。-Samsung Corporation S3C6400 chip BSP source package in support of WinCE6.0, in samsung authentication through the development board above.
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Size: 12174336 |
Author: 龚俊 |
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Description: rk2706 firm for WS806
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Size: 6982656 |
Author: masao |
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Description: RK27SDK 开发包 补丁
iSource.obj, pcCore -> \Library\PC
编译后的 rk27dll.dll 文件
-RK27SDK Development Kit patch iSource.obj, pcCore-> \ Library \ PC \ compiled rk27dll.dll document
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Size: 354304 |
Author: 张杉 |
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Description: RK27 SDK 2008-7-22 的各部分程序-RK27 SDK 2008-7-22 of the various parts of the procedure
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Size: 201728 |
Author: taox |
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Description: RK2705 system upgrade softwire
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Size: 6983680 |
Author: Aeon |
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