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瑞星微公司RK27XX系列芯片的SDK开发包,源码齐备,ADS1.20编译,在RK2706开发板上面验证过,跑起来就是一个功能完备的PMP。-Rising Micro-chip companies RK27XX Series SDK development kit, source code available, ADS1.20 compiler, in the development board RK2706 verified above, running is a full-featured PMP.
Update : 2025-02-17 Size : 27.76mb Publisher : 龚俊

Samsung公司S3C6400芯片的BSP源码包,支持WinCE6.0,在samsung开发板上面验证通过。-Samsung Corporation S3C6400 chip BSP source package in support of WinCE6.0, in samsung authentication through the development board above.
Update : 2025-02-17 Size : 11.61mb Publisher : 龚俊

DL : 0
rk2706 firm for WS806
Update : 2025-02-17 Size : 6.66mb Publisher : masao

RK27SDK 开发包 补丁 iSource.obj, pcCore -> \Library\PC 编译后的 rk27dll.dll 文件 -RK27SDK Development Kit patch iSource.obj, pcCore-> \ Library \ PC \ compiled rk27dll.dll document
Update : 2025-02-17 Size : 346kb Publisher : 张杉

RK27 SDK 2008-7-22 的各部分程序-RK27 SDK 2008-7-22 of the various parts of the procedure
Update : 2025-02-17 Size : 197kb Publisher : taox

RK2705 system upgrade softwire
Update : 2025-02-17 Size : 6.66mb Publisher : Aeon
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