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Description: GumstixII系统的wince6.0的bsp，cpu是intel的xscale，压缩後是安装文件，安装后会在ce文件夹下产生原代码文件夹-GumstixII system wince6.0 the bsp, intel cpu is the xscale, is the installation of compressed paper, After installation in ce folder under the original code folder
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Size: 5896970 |
Author: 王刚 |
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Description: imx27 wince6.0 BSP
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Size: 12186549 |
Author: xuweiyue |
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Description: iMX233 WinCE6.0 BSP (2009-11)
Platform: |
Size: 5355084 |
Author: wyy_hu@126.com |
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Description: Telechip TCC8XXX wince6.0 bsp,可作为平板电脑等的开发平台。
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Size: 26239447 |
Author: root_leaf |
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Description: GumstixII系统的wince6.0的bsp，cpu是intel的xscale，压缩後是安装文件，安装后会在ce文件夹下产生原代码文件夹-GumstixII system wince6.0 the bsp, intel cpu is the xscale, is the installation of compressed paper, After installation in ce folder under the original code folder
Platform: |
Size: 5897216 |
Author: 王刚 |
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Description: ssamsung最近推出的3c2443的wince 6.0 bsp安装手册.-ssamsung recently introduced 3c2443 of wince 6.0 bsp installation manual.
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Size: 1723392 |
Author: 苏可 |
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Description: wince6.0 系统软件一直流程处理 有详细的说明-wince6.0 system software deal flow has been described in detail
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Size: 870400 |
Author: 果子 |
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Description: i.MX27_ADS_BSP_15_Windows_Embedded_CE_6_Reference_Manual I.MX27 最新的WINCE6.0 BSP使用说明文档-i.MX27_ADS_BSP_15_Windows_Embedded_CE_6_Reference_Manual I.MX27 use the latest documentation WINCE6.0 BSP
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Size: 1062912 |
Author: szhacker |
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Description: S3C6410 WinCE6.0 BSP
SMDK6410
FMD
-S3C6410 WinCE6.0 BSPSMDK6410FMD
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Size: 27368448 |
Author: softchip |
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Description: pxa270 wince6.0 BSP包-PXA270 wince6.0 BSP package
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Size: 13581312 |
Author: next |
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Description: DMATEK for Sumsung DMATEK2410 WINCE6.0 BSP
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Size: 684032 |
Author: 李茂瓏 |
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Description: S3C2443 WINCE6.0 BSP
Platform: |
Size: 4753408 |
Author: 阿令 |
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Description: 通过本课件，可了解WinCE，并配置WinCE开发环境，通过虚拟环境配置一个简单的WinCE系统-Through the courseware, can get to know WinCE, and configure the WinCE development environment, virtual environment through a simple configuration of WinCE System
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Size: 2110464 |
Author: posuixukong45 |
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Description: 微软WINCE6.0 基础教程，参加微软培训发的，最新的简解WINCE6.0 的特性，BSP包移植、应用程序的开发等等内容。-Microsoft WINCE6.0 the basis of guidelines issued to attend the training, the latest features Jane WINCE6.0 solution, BSP package transplantation, application development, etc. content.
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Size: 8417280 |
Author: 李康保 |
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Description: TI DM6446 DAVINCI WINCE6.0 BSP
Platform: |
Size: 33129472 |
Author: linchan |
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Description: WINCE 6.0 BSP for platform builder ver BSPSMDK2443_WinCE60_FMD_REL_1.00_071217
Platform: |
Size: 9372672 |
Author: martin |
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Description: 三星2440A Wince6.0 BSP-2440A Wince6.0 BSP
Platform: |
Size: 3893248 |
Author: AAA |
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Description: wince6.0 BSP for s3c6410
Platform: |
Size: 47080448 |
Author: zhanglf08 |
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Description: AMD lx800 wince6.0 bsp包-AMD lx800 wince6.0 bsp
Platform: |
Size: 539648 |
Author: |
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Description: Windows CE6.0 内核定制，
详细介绍Windows CE6.0的定制过程。-Windows CE6.0 kernel customization, custom detail the process of Windows CE6.0.
Platform: |
Size: 586752 |
Author: xujibin |
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