Description: PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas3,AT643,ATLAS3,AT642,arm11的相关资料,并是WINDOWS MOBILE pb,适用于GPS,智能手机等相关领域，希望对你有帮肋的！ Platform: |
Size: 1320434 |
Author:testsb |
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Description: PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas3,AT643,ATLAS3,AT642,arm11的相关资料,并是WINDOWS MOBILE pb,适用于GPS,智能手机等相关领域，希望对你有帮肋的！ Platform: |
Size: 1319936 |
Author:aku_mobile |
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Description: i.MX27 PDK 1.0 Windows Embedded CE 6.0
User s Guide.This user’s guide describes the Freescale i.MX27 3-Stack Windows Embedded CE 6.0 board support package (BSP). The i.MX27 3-Stack reference board is designed for video and voice over Internet phones (V2IP), cordless and mobile phones, point-of-sale terminals, and other embedded industrial and medical applications.
This document explains how to install the BSP and use Microsoft Platform Builder for Windows Embedded CE 6.0 to build, download, and debug OS images. It also explains configuration and features. This document is intended for Microsoft Platform Builder users who want to build and execute Windows Embedded CE 6.0 OS images based on the Freescale i.MX27 3-Stack BSP. Platform: |
Size: 702464 |
Author:allen |
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Description: 杰得科技 x900 arm926 h264 soc windows mobile system BSP-jadechip’s x900 arm926 h264 soc windows mobile system BSP Platform: |
Size: 872448 |
Author:wangweiming |
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Description: SMDK2450 windows mobile 6.1 BSP 对开发windows mobile 很有参考价值-For developing windows Mobile，Base on the S3C2450. Platform: |
Size: 2588672 |
Author:何君 |
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