Description: DS18B20 chip temperature measurement based on the multi-point temperature acquisition design, folders, KEIL environment through internal procedures written in C, simulation tests conducted in proteus inside.
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DS18B20
.......\Backup Of 设计.DBK
.......\Last Loaded 设计.DBK
.......\主程序
.......\......\123
.......\......\123.M51
.......\......\123.c
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.......\......\123.uvopt
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.......\......\123_uvopt.bak
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.......\......\789.LST
.......\......\789.OBJ
.......\......\789.c
.......\基于DS18B20的多点温度测量系统设计报告.doc
.......\提取ROM-ID码
.......\............\001.DSN
.......\............\001.PWI
.......\............\111
.......\............\111.M51
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.......\............\111.lnp
.......\............\111.plg
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.......\............\222.LST
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.......\............\222.c
.......\............\Last Loaded 001.DBK
.......\............\读ID
.......\............\....\001.DSN
.......\............\....\001.PWI
.......\............\....\111
.......\............\....\111.M51
.......\............\....\111.hex
.......\............\....\111.lnp
.......\............\....\111.plg
.......\............\....\111.uvopt
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.......\............\....\111_uvopt.bak
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.......\............\....\222.LST
.......\............\....\222.OBJ
.......\............\....\222.c
.......\............\....\Last Loaded 001.DBK
.......\温度传感器仿真文件夹
.......\....................\123
.......\....................\123.M51
.......\....................\123.hex
.......\....................\123.lnp
.......\....................\123.plg
.......\....................\123.uvopt
.......\....................\123.uvproj
.......\....................\123_uvopt.bak
.......\....................\123_uvproj.bak
.......\....................\789.LST
.......\....................\789.OBJ
.......\....................\789.c
.......\....................\Last Loaded 设计.DBK
.......\....................\设计.DSN
.......\....................\设计.PWI
.......\芯片资料
.......\........\18B20中文资料.pdf
.......\........\74HC573.pdf
.......\........\四位共阴数码管引脚.jpg
.......\设计.DSN
.......\设计.PWI