本文针对英飞凌公司的超低端手机平台，详细研究了ULC2这颗 超低端手机平台芯片的设计。方案设计包括：8x8mm的单芯片方案， 集成GSM基带、RF收发器、电源管理单元、RAM于一体，可单面 布板以形成极其低的成本，支持彩屏等等。并针对ULC

Packet : 超低端手机平台设计.zip filelist
超低端手机平台设计.kdh

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