Description: BGA (ball grid array) display spherical contact, surface mount type packages. In the back of the printed substrate produced by the display means to replace the pin ball bump in the printing substrate positive LSI chip assembly, and then molded resin or potting sealing methods. Also known as the Braille display vector (PAC). Pin can be more than 200, is a multi-pin LSI with a package. Package body can also better than QFP (four-side-pin flat pack) Small. For example, the center distance for the 1.5mm pin 360-pin BGA only 31
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BGA(ball grid array).pdf
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