Title:
IC-Integration_of_non-packaging_system
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Description: The research project for mobile phones, M P4 and other portable electronic products on the IC chip, high-density packaging needs, the latest national patent ' bare-chip packaging method building blocks' , will be on the same integrated circuit on the PCB, like die Like squeezing blocks embedded in the PC B, the use of lithography for semiconductor chip and between chips and PC B flat interconnection between the direct, complete e-machine board manufacturing process. Electronic machine using this method can reduce the chip size of the template 5 to 20 times. This paper studies the content of the patented invention, technical innovation, technology implementation plan and typical applications for a more detailed introduction.
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IC-Integration_of_non-packaging_system.pdf
