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Description: 机器视觉软件开发库，功能是在ＢＧＡ自动定位上使用-machine vision software development bank, the BGA function is the use of automatic positioning
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Size: 1884836 |
Author: yms |
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Description: BGA封装详细介绍--Detailed description of BGA packaging.
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Size: 552033 |
Author: 彭明 |
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Description: BGA封装详细介绍--Detailed description of BGA packaging.
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Size: 551936 |
Author: 彭明 |
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Description: 机器视觉软件开发库，功能是在ＢＧＡ自动定位上使用-machine vision software development bank, the BGA function is the use of automatic positioning
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Size: 1884160 |
Author: yms |
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Description: BGA CHIP PLACEMENT AND ROUTING RUL
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Size: 165888 |
Author: 易先林 |
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Description: 关于FPGA的BGA封装的PCB布线知识，对BGA封装的PCB布线有较大帮助-on FPGA BGA knowledge of the PCB, BGA on the PCB be helpful
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Size: 897024 |
Author: liujie |
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Description: UCOS在LPC2378开发板里面的原版移植程序-UCOS in LPC2378 development board inside the original transplant procedure
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Size: 30720 |
Author: 雷志广 |
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Description: 精心整理的S3C2410引脚排列图，S3C2410 BGA布线PCB必备！建议画板子时先对照该图，找找规律，可以起到事半功倍的效果！-The S3C2410 carefully collated with map pins, S3C2410 BGA routing PCB must! Sketchpad midnight before the proposed control of the map, look for the law, you can play a multiplier effect!
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Size: 5120 |
Author: 马龙 |
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Description: 6713的PCB封装图（BGA），可用protel99se打开-6713 map of the PCB package (BGA), can be used to open Protel99SE
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Size: 2048 |
Author: aaa |
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Description: protel 下的 TI TMS320VC5509AZHH BGA封装库,加上些常用的如TSSOP28,以及TFT的接口插座封装库,自己用的希望对开发DSP 5509A的朋友有帮助.-Protel under Treasury TI TMS320VC5509AZHH BGA package, together with the more commonly used as TSSOP28, and TFT package socket interface library, with the hope of their own on the development of DSP 5509A friends help.
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Size: 19456 |
Author: thzbigone |
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Description: BGA 布线基础，基本的bga pcb设计要点-BGA cabling infrastructure, basic bga pcb design features
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Size: 463872 |
Author: txs |
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Description: BGA(ball grid array)
球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。也称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为1.5mm 的360 引脚BGA 仅为31-BGA (ball grid array) display spherical contact, surface mount type packages. In the back of the printed substrate produced by the display means to replace the pin ball bump in the printing substrate positive LSI chip assembly, and then molded resin or potting sealing methods. Also known as the Braille display vector (PAC). Pin can be more than 200, is a multi-pin LSI with a package. Package body can also better than QFP (four-side-pin flat pack) Small. For example, the center distance for the 1.5mm pin 360-pin BGA only 31
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Size: 56320 |
Author: xujj |
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Description: 作者收集了有关BGA图像处理的相关英文资料，供大家分享，请大家提出宝贵意见，-BGA authors collected data on the relevant image processing information in English for all to share, please put forward valuable suggestions, thank you
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Size: 32841728 |
Author: derekwang |
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Description: BGA Binary Genetic Algorithm Matlab Code-BGA Binary Genetic Algorithm Matlab Code
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Size: 2048 |
Author: mashomid |
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Description: BGA布线规则,适合嵌入式硬件开发的初学者，很有用-design rules for BGA
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Size: 236544 |
Author: 周少平 |
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Description: BGA封装的pcb布线要点word文档，蛮好的-BGA package, pcb layout elements, is useful
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Size: 225280 |
Author: 吴思良 |
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Description: 采用图像识别定位技术,对BGA定位获取芯片中心位置-Positioning of the BGA by image
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Size: 1884160 |
Author: 馒头 |
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Description: 各种BGA（Ball Grid Array）（焊球阵列封装），封装的PCB封装(All kinds of BGA PCB)
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Size: 282624 |
Author: FRANZKFK
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Description: Altium Designer BGA扇出，原理图中PCB的类和布线规则设置(Altium Designer BGA fan out, PCB class and wiring rule setting in schematic)
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Size: 760832 |
Author: sjjune
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Description: BGA manual for soldering
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Size: 2377728 |
Author: razor123 |
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