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Description: 关于FPGA的BGA封装的PCB布线知识，对BGA封装的PCB布线有较大帮助-on FPGA BGA knowledge of the PCB, BGA on the PCB be helpful
Platform: |
Size: 897042 |
Author: liujie |
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Description: 精心整理的S3C2410引脚排列图，S3C2410 BGA布线PCB必备！建议画板子时先对照该图，找找规律，可以起到事半功倍的效果！
Platform: |
Size: 5049 |
Author: 马龙 |
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Description: 6713的PCB封装图（BGA），可用protel99se打开
Platform: |
Size: 2417 |
Author: aaa |
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Description: 关于FPGA的BGA封装的PCB布线知识，对BGA封装的PCB布线有较大帮助-on FPGA BGA knowledge of the PCB, BGA on the PCB be helpful
Platform: |
Size: 897024 |
Author: liujie |
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Description: cadence公司pcb内部培训的资料,并且附带其中的例子程序!比市面上任何一本cadence的书好!-pcb-house training cadence company information, and examples of procedures attached to them! than a cadence on the market any good books!
Platform: |
Size: 17671168 |
Author: 周刚 |
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Description: ATMEL AT91SAM9260 series PCB source file.
Platform: |
Size: 82944 |
Author: 李恩东 |
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Description: 精心整理的S3C2410引脚排列图，S3C2410 BGA布线PCB必备！建议画板子时先对照该图，找找规律，可以起到事半功倍的效果！-The S3C2410 carefully collated with map pins, S3C2410 BGA routing PCB must! Sketchpad midnight before the proposed control of the map, look for the law, you can play a multiplier effect!
Platform: |
Size: 5120 |
Author: 马龙 |
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Description: 6713的PCB封装图（BGA），可用protel99se打开-6713 map of the PCB package (BGA), can be used to open Protel99SE
Platform: |
Size: 2048 |
Author: aaa |
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Description: BGA 布线基础，基本的bga pcb设计要点-BGA cabling infrastructure, basic bga pcb design features
Platform: |
Size: 463872 |
Author: txs |
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Description: BGA PCB的机器视觉檢測
一个台湾的实际视觉识别项目的技术文档
耀文電子廠商委託案，其主要是要計算出電路版中孔的位置
先前設計:手動操作的程式。
更新：讓電腦來自動量測。
-BGA PCB testing machine vision a practical visual recognition of Taiwan s technical documentation project commissioned case Yaowen electronics companies, its main circuit board to calculate the location of Mesoporous previous design: manual operation of the program. Update: Let the computer from the measured momentum.
Platform: |
Size: 3272704 |
Author: yezi |
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Description: 推荐BGA布线方法，希望在pcb设计中有所帮助-Recommended BGA wiring, and I hope that in the pcb design help
Platform: |
Size: 391168 |
Author: renaifeng |
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Description: 本应用指南针对 FT256 1 mm BGA 封装的 Spartan™ -3E FPGA，讨论了低成本、四至六层、
大批量印刷电路板 (PCB) 的布局问题，同时探讨高速信号和信号完整性 (SI) 因素对低层数 PCB
布局的影响。-Application Guide for the FT256 1 mm BGA package, Spartan ™-3E FPGA, the discussion of the low-cost, four to six, high-volume printed circuit board (PCB) layout issues, and exploring the possibility of high-speed signals and signal integrity (SI) factor PCB layout of the low-impact.
Platform: |
Size: 897024 |
Author: 梅子 |
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Description: BGA布线规则,适合嵌入式硬件开发的初学者，很有用-design rules for BGA
Platform: |
Size: 236544 |
Author: 周少平 |
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Description: PCB制版使用的各种封装尺寸型号，包括BGA，LQFP-PCB plate size used in a variety of package types, including BGA, LQFP, etc.
Platform: |
Size: 6588416 |
Author: zt |
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Description: BGA封装的pcb布线要点word文档，蛮好的-BGA package, pcb layout elements, is useful
Platform: |
Size: 225280 |
Author: 吴思良 |
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Description: 随着可编程器件(PLD) 密度和I/O 引脚数量的增加，对小封装和各种封装
形式的需求在不断增长。球栅阵列(BGA) 封装在器件内部进行I/O 互联，
提高了引脚数量和电路板面积比，是比较理想的封装方案。在相同面积
上，典型的BGA 封装互联数量是四方扁平(QFP) 封装的两倍。而且，BGA
焊球要比QFP 引线强度高的多，可靠的封装能够承受更强的冲击。
Altera 为高密度PLD 用户开发了高密度BGA 解决方案。这种新的封装形
式占用的电路板面积不到标准BGA 封装的一半。
本应用笔记旨在帮助您完成Altera 高密度BGA 封装的印刷电路板(PCB)
设计，并讨论：
■ BGA 封装简介
■ PCB 布板术语
■ 高密度BGA 封装PCB 布板-As programmable logic devices (PLDs) increase in density and I/O pins,
the demand for small packages and diverse packaging options continues
to grow. Ball-grid array (BGA) packages are an ideal solution because the
I/O connections are on the interior of the device, improving the ratio
between pin count and board area. Typical BGA packages contain up to
twice as many connections as quad flat pack (QFP) packages for the same
area. Further, BGA solder balls are considerably stronger than QFP leads,
resulting in robust packages that can tolerate rough handling.
Altera has developed high-density BGA solutions for users of
high-density PLDs. These new formats require less than half the board
space of standard BGA packages.
This application note provides guidelines for designing your printed
circuit board (PCB) for Altera’s high-density BGA packages and
discusses:
■ Overview of BGA Packages
■ PCB Layout Terminology
■ PCB Layout for High-Density BGA Packages
Platform: |
Size: 391168 |
Author: acermouse |
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Description: BGA是PCB上常用的组件。介绍了BGA package 的走线规则。-BGA is commonly used in PCB assembly. Describes the rules for the alignment of BGA package.
Platform: |
Size: 237568 |
Author: ht |
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Description: 告诉你BGA下的过孔要求，帮助你进行大型PCB设计-Tell BGA under the vias requirements the help you carry out a large-scale PCB design
Platform: |
Size: 16384 |
Author: feihu |
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Description: 各种BGA（Ball Grid Array）（焊球阵列封装），封装的PCB封装(All kinds of BGA PCB)
Platform: |
Size: 282624 |
Author: FRANZKFK
|
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Description: Altium Designer BGA扇出，原理图中PCB的类和布线规则设置(Altium Designer BGA fan out, PCB class and wiring rule setting in schematic)
Platform: |
Size: 760832 |
Author: sjjune
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