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Description: 用担心QFP 那样的引脚变形问题。
该封装是美国Motorola 公司开发的，首先在便携式电话等设备中被采用，今后在美国有可
能在个人计算机中普及。最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为225。现在也有
一些LSI 厂家正在开发500 引脚的BGA。
BGA 的问题是回流焊后的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，
由于焊接的中心距较大，连接可以看作是稳定的，只能通过功能检查来处理。
美国Motorola 公司把用模压树脂密封的封装称为OMPAC，而把灌封方法密封的封装称为
GPAC(见OMPAC 和GPAC)。
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Size: 8035 |
Author: 在工革 |
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Description: 微细间距QFP器件手工焊接指南
介绍如何拆除清洗和更换一个具有 0.5 mm间距的 48脚 TQFP器件
Platform: |
Size: 2020000 |
Author: 谢华 |
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Description: 微细间距QFP器件手工焊接指南,希望对大家有用
Platform: |
Size: 1596277 |
Author: huangya |
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Description: 是英文 “ Surface mount technology ”的缩写。即表面安装技术，这是一种较传统的安装方式。其优点是可靠性高，缺点是体积大，成本高，限制 LCM 的小型化。
是英文 “ Chip On Board ”的缩写。即芯片被邦定(Bonding)在PCB上，由于IC制造商在LCD控制及相关芯片的生产上正在减小QFP（ SMT 的一种）封装的产量，因此，在今后的产品中传统的 SMT 方式将被逐步取代。
Platform: |
Size: 36177 |
Author: xjf |
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Description: 用担心QFP 那样的引脚变形问题。
该封装是美国Motorola 公司开发的，首先在便携式电话等设备中被采用，今后在美国有可
能在个人计算机中普及。最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为225。现在也有
一些LSI 厂家正在开发500 引脚的BGA。
BGA 的问题是回流焊后的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，
由于焊接的中心距较大，连接可以看作是稳定的，只能通过功能检查来处理。
美国Motorola 公司把用模压树脂密封的封装称为OMPAC，而把灌封方法密封的封装称为
GPAC(见OMPAC 和GPAC)。-To worry about that kind of pin QFP deformation. The package is developed by Motorola, the first portable phones and other devices used in the future in the United States is possible in the popularity of personal computers. Initially, BGA pin (bump) for the center distance of 1.5mm, pin number is 225. LSI now some manufacturers are developing 500-pin BGA. BGA problem is the appearance after reflow inspection. It is not clear whether the appearance of an effective method of examination. Some believe that as a result of welding the center distance of a larger connection can be seen as a stable, only through the function test to deal with it. Motorola United States companies to use molded resin sealed package called OMPAC, and the casting method known as the sealed package GPAC (see OMPAC and GPAC).
Platform: |
Size: 8192 |
Author: 在工革 |
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Description: 微细间距QFP器件手工焊接指南
介绍如何拆除清洗和更换一个具有 0.5 mm间距的 48脚 TQFP器件-Fine pitch QFP devices manual welding guide describes how to dismantle cleaning and replacement of a 0.5 mm pitch 48-pin TQFP devices
Platform: |
Size: 2019328 |
Author: 谢华 |
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Description: 微细间距QFP器件手工焊接指南,希望对大家有用-Fine pitch QFP devices guide manual welding, in the hope that useful to everybody
Platform: |
Size: 1596416 |
Author: huangya |
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Description: 是英文 “ Surface mount technology ”的缩写。即表面安装技术，这是一种较传统的安装方式。其优点是可靠性高，缺点是体积大，成本高，限制 LCM 的小型化。
是英文 “ Chip On Board ”的缩写。即芯片被邦定(Bonding)在PCB上，由于IC制造商在LCD控制及相关芯片的生产上正在减小QFP（ SMT 的一种）封装的产量，因此，在今后的产品中传统的 SMT 方式将被逐步取代。
-脢脟脫 垄 脦脛 隆 掳 Surface mount technology 隆 卤 渭脛脣玫脨
Platform: |
Size: 35840 |
Author: xjf |
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Description: BGA(ball grid array)
球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。也称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为1.5mm 的360 引脚BGA 仅为31-BGA (ball grid array) display spherical contact, surface mount type packages. In the back of the printed substrate produced by the display means to replace the pin ball bump in the printing substrate positive LSI chip assembly, and then molded resin or potting sealing methods. Also known as the Braille display vector (PAC). Pin can be more than 200, is a multi-pin LSI with a package. Package body can also better than QFP (four-side-pin flat pack) Small. For example, the center distance for the 1.5mm pin 360-pin BGA only 31
Platform: |
Size: 56320 |
Author: xujj |
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Description: CDIP-----Ceramic Dual In-Line Package
CLCC-----Ceramic Leaded Chip Carrier
CQFP-----Ceramic Quad Flat Pack
DIP-----Dual In-Line Package
LQFP-----Low-Profile Quad Flat Pack
MAPBGA------Mold Array Process Ball Grid Array
PBGA-----Plastic Ball Grid Array
PLCC-----Plastic Leaded Chip Carrier
PQFP-----Plastic Quad Flat Pack
QFP-----Quad Flat Pack
SDIP-----Shrink Dual In-Line Package
SOIC-----Small Outline Integrated Package
SSOP-----Shrink Small Outline Package-CDIP-----Ceramic Dual In-Line Package
CLCC-----Ceramic Leaded Chip Carrier
CQFP-----Ceramic Quad Flat Pack
DIP-----Dual In-Line Package
LQFP-----Low-Profile Quad Flat Pack
MAPBGA------Mold Array Process Ball Grid Array
PBGA-----Plastic Ball Grid Array
PLCC-----Plastic Leaded Chip Carrier
PQFP-----Plastic Quad Flat Pack
QFP-----Quad Flat Pack
SDIP-----Shrink Dual In-Line Package
SOIC-----Small Outline Integrated Package
SSOP-----Shrink Small Outline Package
Platform: |
Size: 149504 |
Author: newstar |
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Description: QFP programmer ZORAN VADDIS
Platform: |
Size: 607232 |
Author: genn |
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Description: Driver for QFP (Zoran Quick Flash Programmer) for supporting the Spansion S29AL008D Flash chip
Platform: |
Size: 80896 |
Author: ThijsNL |
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Description: 随着可编程器件(PLD) 密度和I/O 引脚数量的增加，对小封装和各种封装
形式的需求在不断增长。球栅阵列(BGA) 封装在器件内部进行I/O 互联，
提高了引脚数量和电路板面积比，是比较理想的封装方案。在相同面积
上，典型的BGA 封装互联数量是四方扁平(QFP) 封装的两倍。而且，BGA
焊球要比QFP 引线强度高的多，可靠的封装能够承受更强的冲击。
Altera 为高密度PLD 用户开发了高密度BGA 解决方案。这种新的封装形
式占用的电路板面积不到标准BGA 封装的一半。
本应用笔记旨在帮助您完成Altera 高密度BGA 封装的印刷电路板(PCB)
设计，并讨论：
■ BGA 封装简介
■ PCB 布板术语
■ 高密度BGA 封装PCB 布板-As programmable logic devices (PLDs) increase in density and I/O pins,
the demand for small packages and diverse packaging options continues
to grow. Ball-grid array (BGA) packages are an ideal solution because the
I/O connections are on the interior of the device, improving the ratio
between pin count and board area. Typical BGA packages contain up to
twice as many connections as quad flat pack (QFP) packages for the same
area. Further, BGA solder balls are considerably stronger than QFP leads,
resulting in robust packages that can tolerate rough handling.
Altera has developed high-density BGA solutions for users of
high-density PLDs. These new formats require less than half the board
space of standard BGA packages.
This application note provides guidelines for designing your printed
circuit board (PCB) for Altera’s high-density BGA packages and
discusses:
■ Overview of BGA Packages
■ PCB Layout Terminology
■ PCB Layout for High-Density BGA Packages
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Size: 391168 |
Author: acermouse |
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Description:
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Size: 22528 |
Author: LION ERRANT |
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Description: HW Settings files for RTD1283, for bootloader serial recovery-HW Settings files for RTD1283, for bootloader serial recovery:
mars.BGA.64x2.bin
mars.QFP.128x1.bin
Platform: |
Size: 1024 |
Author: cxjt |
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Description: 本程序是ansys APDL语言编写的电子封装结构散热分析-Electronic structure of finite element analysis package QFP
Platform: |
Size: 3072 |
Author: 谭春华 |
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Description: 基于MATLAB的QFP焊点图像预处理，包括滤波，边缘提取-MATLAB QFP solder joint image pre-processing, including filtering, edge extraction
Platform: |
Size: 1024 |
Author: fanbing |
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Description: PCB file and datasheet of ADAPTER 44pins DIP to 44pins QFP.
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Size: 805888 |
Author: huan |
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Description: PCL6045B运动控制芯片，由NPM公司生产，是一种通过总线接收CPU命令、并产生脉冲控制步进电机或脉冲驱动型伺服电机的CMOS大规模集成芯片，可提供多种输出运动控制功能，包括连续、定长、回原点等输出方式，采用176针QFP封装，5V±10％和3.3V±10％双电源供电，工作温度范围－40℃～70℃。芯片功能丰富、硬件接口和软件编程简单、集成度和可*性高，可以广泛应用于数控机床、纺织机械、印刷机械、包装机械、各类切割机、雕刻机、机器人等数控机械的运动控制中。-PCL6045B motion control chip, produced by the NPM, is a CPU command received via the bus, and produce large-scale integration of CMOS chip stepper motor or pulse-driven servo motor pulse control, can provide a variety of output motion control functions, including continuousfixed-length output back to the origin using the 176-pin QFP package, 5V ± 10 and 3.3V ± 10 of dual power supply, operating temperature range-40 ℃ ~ 70 ℃. The chips feature-rich, simple hardware interface and software programming, integration and can be*, can be widely used in the sport of the CNC machine tools, textile machinery, printing machinery, packaging machinery, all kinds of cutting machines, engraving machines, robots and other CNC machinery control
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Size: 8600576 |
Author: long |
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Description: ssop，sot，qfp等在altium designer中的常用封装,-ssop，sot，qfp PCB
Platform: |
Size: 1642496 |
Author: wangyu |
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