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Description: Dallas Semiconductor基于8051的微控制器类产品中,许多型号都支持通过通用RS-232串口实现在系统编程。-Dallas Semiconductor MTK
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Size: 1494016 |
Author: Mr.mao |
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Description: 本研究项目针对手机、 M P4 等便携式电子产品对 I C芯片的高密度封装需求, 采用最新的国家发
明专利 ‘裸芯片积木式封装方法’, 将在同一块印制板上的集成电路裸芯片像积木一样挤紧嵌入在
PC B中, 用半导体光刻工艺进行芯片间以及芯片和 PC B间的直接平面互连, 完成电子整机板的制造过
程。 采用该方法可使电子整机芯片模板的体积缩小 5 到 20 倍。 本文对该项专利发明的研究内容、 技术
创新点、 工艺实施方案及典型应用等进行了较详细的介绍。-The research project for mobile phones, M P4 and other portable electronic products on the IC chip, high-density packaging needs, the latest national patent ' bare-chip packaging method building blocks' , will be on the same integrated circuit on the PCB, like die Like squeezing blocks embedded in the PC B, the use of lithography for semiconductor chip and between chips and PC B flat interconnection between the direct, complete e-machine board manufacturing process. Electronic machine using this method can reduce the chip size of the template 5 to 20 times. This paper studies the content of the patented invention, technical innovation, technology implementation plan and typical applications for a more detailed introduction.
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Size: 178176 |
Author: Iguodala99 |
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Description: XGM SOA model for semiconductor optical amplifier
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Size: 1024 |
Author: silver |
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Description: ARM Assembly Language : Fundamentals and Techniques
Second Edition
William Hohl held the position of Worldwide University Relations Manager for
ARM, based in Austin, Texas, for 10 years. He was with ARM for nearly 15 years
and began as a principal design engineer to help build the ARM1020 microprocessor. His travel and university lectures have taken him to over 40 countries on 5
continents, and he continues to lecture on low-power microcontrollers and assembly
language programming. In addition to his engineering duties, he also held an adjunct
faculty position in Austin 1998 to 2004, teaching undergraduate mathematics.
Before joining ARM, he worked at Motorola (now Freescale Semiconductor) in the
ColdFire and 68040 design groups and at Texas Instruments as an applications engineer. He holds MSEE and BSEE degrees Texas A&M University as well as six
patents in the field of debug architectures.-ARM Assembly Language : Fundamentals and Techniques
Second Edition
William Hohl held the position of Worldwide University Relations Manager for
ARM, based in Austin, Texas, for 10 years. He was with ARM for nearly 15 years
and began as a principal design engineer to help build the ARM1020 microprocessor. His travel and university lectures have taken him to over 40 countries on 5
continents, and he continues to lecture on low-power microcontrollers and assembly
language programming. In addition to his engineering duties, he also held an adjunct
faculty position in Austin 1998 to 2004, teaching undergraduate mathematics.
Before joining ARM, he worked at Motorola (now Freescale Semiconductor) in the
ColdFire and 68040 design groups and at Texas Instruments as an applications engineer. He holds MSEE and BSEE degrees Texas A&M University as well as six
patents in the field of debug architectures.
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Size: 3572736 |
Author: Ranjith |
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Description: 这是用四阶龙格库塔法计算半导体激光器速率方程的工程，源代码用C语言书写，开发平台为VC6.0。程序输出数据被写入文件SLdata.txt中，其中第一列为仿真时间，第二列为载流子浓度，第三列为光子密度。为了方便更多相关开发者调试，还提供了一个matlab源文件test.m。test.m用于将计算数据在matlab中用曲线显示。-This is project developed by Visual C++ 6.0 software platform, which uses the 4th order Runge Kutta method to solve the rate equations in semiconductor lasers. The computational results is placed in the file named by SLdata.txt , in which the first colomn stand for the simulation time, the second represents the carrier density at corresponding time, and the third colomn is the photon density. For convinence, another matlab source code file is also presented, which can be used to display the simulation data by some plots within Matlab environment.
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Size: 1103872 |
Author: 王刚 |
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Description: Abstract: The paper presents the design and implementation of LVDS (low-voltage differential signaling) receiver circuit, fully
compatible with LVDS standard. The proposed circuit is composed of the telescopic amplifier and the comparator with internal
hysteresis. The receiver supports 3.5 Gbps data rate with 7.4 mA current at 1.8 V supply according to post-layout circuit simulations.
The circuit has the power consumption of 13.1 MW. Comparing with the conventional circuit, the circuit is achieved to reduce the
power consumption by 19.1% and the data rate by 14.3%. The validity and effectiveness of the proposed circuit are verified through the
circuit simulation with Samsung 0.18 μm CMOS (complementary metal-oxide-semiconductor) standard technology under the 1.8 V
supply voltage.
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Size: 615465 |
Author: ggc_gcc |
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