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[WinSock-NDISAtool

Description: A tool portfolio elimination mechanism (TPEM) for a wafer fab
Platform: | Size: 173864 | Author: 阿杜 | Hits:

[Internet-NetworkAtool

Description: A tool portfolio elimination mechanism (TPEM) for a wafer fab
Platform: | Size: 174080 | Author: 阿杜 | Hits:

[CommunicationSCommTest

Description: 通过串口控制FPGA晶圆测试电路的软件,用于学生做相关实验-FPGA through the serial control circuit wafer testing software for students to do experiments
Platform: | Size: 31744 | Author: cxy | Hits:

[Other02MemRepair

Description: 内存修改,用该进程可以修改内存中的数据,如在金山游侠中可以修改选手的生命值等-Redundancy Repair is a process step almost exclusively used for memory chips. The best way to think of this is via the analogy of the spare wheel in a car. The spare is a redundant fifth wheel carried and used in the event a defect occurs in one of the other four. Similarly, a memory is designed with redundant rows and columns (spares) which can be logically replaced for rows or columns which may contain defective memory cells. The replacement is made by special precision tools which take the wafer probe failure data, locate the failed element, and use a laser beam to perform micro-surgery on links to remove the defective element and connect in a replacement.
Platform: | Size: 1209344 | Author: 暮渔 | Hits:

[Embeded-SCM DevelopTimedelayfunction

Description: 一个基于12M和6M晶振的延时函数,包括1us,2us,5us10us,20us,50us100us,200us,500u1ms,2ms,5ms10ms,20ms,50ms 0.1s,0.2s,0-Based on a wafer 12M 6M and vibration of delay function, including 1us, 2us, 5us10us, 20us, 50us100us, 200us, 500u1ms, 2ms, 5ms10ms, 20ms, 50ms 0.1 s, 0.2 s, 0
Platform: | Size: 23552 | Author: 陈辉 | Hits:

[Other systemsFabricationAndPackagingOfWafer

Description: 本文件为pdf格式,主要介绍微电子行业中晶圆的制造和封装。-Pdf format for this document, mainly the microelectronics industry, wafer manufacturing and packaging.
Platform: | Size: 331776 | Author: xiaocao | Hits:

[OtherOP07_a

Description: The OP07 has very low input offset voltage (75 μV max for OP07E) which is obtained by trimming at the wafer stage. These low offset voltages generally eliminate any need for external nulling. The OP07 also features low input bias current (±4 nA for OP07E) and high open-loop gain
Platform: | Size: 194560 | Author: meyssam | Hits:

[VHDL-FPGA-VerilogTaiwan_wafer_VHDL_training_materials

Description: 台湾晶元内部VHDL培训资料 大量c语言例程 讲解主要为英文 少量繁体中文-Taiwan wafer training materials, a large number of c within the VHDL language routines deal mainly with a small amount of English Traditional Chinese
Platform: | Size: 2984960 | Author: 郎海默 | Hits:

[Other systemsCapacitor_Voltage_test

Description: 控制吉时利公司的CV590设备,来测试半导体器件以及分立器件的电容及电导程序及算法。-control CV590 intruments to measure capacitor and conductor of wafer or capacitor.
Platform: | Size: 21504 | Author: zhaoanyu | Hits:

[Other systemsReliablity_ramp

Description: 实现了Jedec标准中对超薄膜氧化层的MOS电容的Time-zero可靠性测试方法。可直接用于半导体器件可靠性测试中-a realization of Time-zero dilectric breakdown according to Jedec standard,which can use to achieve reliability of wafer
Platform: | Size: 37888 | Author: zhaoanyu | Hits:

[Software EngineeringH.264_MPEG-4_AVC.ZIP

Description: H264 MPEG4 AVC画面编码器之架构设计与晶片制作,台湾硕士论文-H264 MPEG4 AVC encoder of the structure of the screen design and wafer production, Taiwan, Master s thesis
Platform: | Size: 1184768 | Author: lauyee | Hits:

[Software Engineeringpxa270um

Description: 是学习嵌入式的很好的一块板子,ARM系列。对于入门的新手来说 很好-it s about pxa270um,a circuit wafer of arm.
Platform: | Size: 5924864 | Author: 张晓霞 | Hits:

[MPIdata_obj.py

Description: Python object for wafer data management
Platform: | Size: 1024 | Author: 郭抬鳴 | Hits:

[Program docattachments_2010_04_24

Description: Chapter 7 Metallization Definition: Processes that deposit metal thin film on wafer surface Applications Interconnection Gate and electrodes Chapter 9 Manufacturing Issues Nanolithography RIE
Platform: | Size: 1673216 | Author: majdi | Hits:

[Windows DevelopeM_P

Description: eM_Plant虚拟晶圆制造自动组合装置 eM_Plant automatic virtual wafer fabrication assemblies-eM_Plant automatic virtual wafer fabrication assemblies
Platform: | Size: 977920 | Author: yew456 | Hits:

[matlabdsp-project-final

Description: SILICON WAFER DEFECT DETECTION An automated system developed for defect analysis and reporting of defects in a semiconductor wafer-SILICON WAFER DEFECT DETECTION An automated system developed for defect analysis and reporting of defects in a semiconductor wafer
Platform: | Size: 18432 | Author: anishkumar | Hits:

[Special Effectsedge-eaxm

Description: 通过对硅片图像的处理,实现对硅片中晶畴边缘的识别以及晶畴个数的统计,从而获得硅片结晶度的信息。克服了以往在太阳能电池生产过程中判断标准不统一、人工漏检等情况的发生,可实现由机器替代人工对每片衬底的检测。 项目的研究成果不仅可以应用在硅片衬底的检测上,对于其他低对比度图像,包含边缘提取以及面积统计等方面的处理,均可采用。这体现了本研究成果具有很强的实用性和很广的应用范围,具有很高的使用价值。 -Through the image processing to silicon chips, and to realize the dependence of ceramics edge silicon wafer recognition and then the number of statistics, to get the information crystallinity silicon chips. To overcome the previous in solar cell manufacturing process judgment standard not unity, artificial leak wait for the happening of the circumstance, can be achieved by machine to replace artificial each piece of substrate detection. The research results of the project can be used not only in the silicon substrate detection, in the other low contrast images, including edge extraction and area of statistics, and other aspects of the handle, all can use. It shows the research results have very strong practicability and a very wide application range, has the very high use value.
Platform: | Size: 3072 | Author: liuxiaoya | Hits:

[Windows CEgppve_3_6_navypier_2_0_0

Description: Intel Atom N270/945GSE的BSP 6.6下使用-Intel Atom N270/945GSE的BSP for workbench3.0 vxworks 6.6
Platform: | Size: 8755200 | Author: rll | Hits:

[Mathimatics-Numerical algorithmsd4ef13.ZIP

Description: 低温玻璃浆料圆片级真空封装的研究Low temperature glass frit wafer level research on vacuum packaging-Low temperature glass frit wafer level research on vacuum packaging
Platform: | Size: 234496 | Author: xi520 | Hits:

[CSharpWafermapDisplay-master

Description: Drawing wafer use windows form
Platform: | Size: 57344 | Author: Caesar Lee | Hits:
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